发明名称
摘要 <p>An electronic part having mounting terminals made of a thermally-meltable bonding material is mounted on a mounting board. A structural part is used for moving a height-adjusting member to a position under the electronic part in a process of heating and melting the thermally-meltable bonding material so as to maintain a predetermined distance between the electronic part and the mounting board.</p>
申请公布号 JP4930049(B2) 申请公布日期 2012.05.09
申请号 JP20060352747 申请日期 2006.12.27
申请人 发明人
分类号 H05K1/18;H01L21/60 主分类号 H05K1/18
代理机构 代理人
主权项
地址
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