发明名称 METHOD FOR FORMING PATTERN FOR TRANSPARENT CONDUCTIVE LAYER
摘要 Provided is a low-cost method for easily forming a transparent conductive pattern that has a low electrical resistance and high transparency, and that is highly invisible to the eye. The method for forming a transparent conductive layer pattern includes the steps of (1) detachably forming a transparent conductive layer on a substrate; (2) then forming, on a support, a negative-patterned heat-sensitive adhesive image; (3) bonding the substrate to the support so that the transparent conductive layer and the heat-sensitive adhesive layer are in close contact with each other; (4) forming a pattern of the transparent conductive layer on the substrate by detaching the support from the substrate to transfer a portion of the transparent conductive layer, the portion being in close contact with the heat-sensitive adhesive layer, to the heat-sensitive adhesive layer; and (5) fixing the transparent conductive layer on the substrate by applying a coating material for a protective layer onto a front surface of the substrate on which the pattern of the transparent conductive layer is formed and impregnating the transparent conductive layer with the coating material.
申请公布号 EP2450915(A1) 申请公布日期 2012.05.09
申请号 EP20100794130 申请日期 2010.06.29
申请人 DIC CORPORATION 发明人 YAMAZAKI YOSHIKAZU;HAYAKAWA SATOSHI;MIYAMOTO MASASHI
分类号 H01B13/00;G06F3/041;G06F3/044;H05K3/04 主分类号 H01B13/00
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