发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a circuit substrate such that even if a shock is applied to a base, a wiring conductor is made not apt to receive the shock and then hardly shifts in position, and to provide a package, and an electronic device. <P>SOLUTION: Disclosed is the circuit substrate which comprises the base 1 made of a dielectric and the wiring conductor 2 whose reverse surface is joined to one main surface of the base 1, the center of gravity of the wiring conductor 2 being positioned on a top surface side as compared with the thickness-directional center of the wiring conductor 2. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP4926033(B2) 申请公布日期 2012.05.09
申请号 JP20070333136 申请日期 2007.12.25
申请人 发明人
分类号 H01L23/12;H01L23/08;H01L23/13 主分类号 H01L23/12
代理机构 代理人
主权项
地址