| 摘要 |
1,027,550. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. Jan. 15, 1965 [Jan. 20, 1964], No. 2370/64. Heading H1K. In mounting a wafer containing one or more circuit elements with one face to a substrate, the correct orientation of the wafer is determined by reference to distinctive markings on the opposite wafer face, which alone or in combination with the edges of the wafer give a unique indication of orientation. A wafer with a plurality of silicon transistors formed in one face by the planar process described in Specification 1,022,366 has a series of triangular films formed on the opposite face by deposition of gold and chromium through a mask, the markings being spaced so that at least one appears on each transistor divided from the wafer. Such a transistor 4 (Fig. 5) is placed with its tinned gold-chromium electrodes 1, 2, 3 engaging conductive tracks 7, 8, 9 on a glass substrate 11, and the edges aligned with edges of the tracks as shown, with the side of the triangle parallel to a wafer edge aligned with tracks 7, 8, and soldered in place. Depressions or raised mounds formed by etching or ultransonic cutting, or paint marks may replace the metal triangles. Where a number of devices are to be mounted on a common substrate an apertured metal jig is placed in register with the substrate and the devices dropped in the apertures with all the marks aligned. Devices may be mounted on the wires of a header by a similar technique. |
