| 摘要 |
PURPOSE: A thin molded body is provided to excellent impact resistance in spite of thin thickness, to have low dimensional change due to absorption, thereby suitable for inside chassis or for housing of electronic devices like mobile phone, etc. CONSTITUTION: A thin molded body is provided to obtain from resin composition containing a resin-impregnated fiber bundle. The resin-impregnated fiber bundle contains aliphatic polyamide, and the content of the glass fiber is 40-70 weight%. In the molded body, tensile nominal strain in case of tensile test at 500 mm/min by using ISO multifunctional specimen is 2.0% or higher, bending elastic modulus in absolute dry condition is 10 GPa or higher, and Charpy impact strength is 30 kJ or higher. |
