| 摘要 |
PROBLEM TO BE SOLVED: To allow more semiconductor chips to be manufactured from one semiconductor wafer by reducing the width of edge exclusion as much as possible while preventing the occurrence of liquid leakage and securing a sufficient contact area with a contact for power supply. SOLUTION: A ring-shaped seal part is provided which is brought into contact with a peripheral edge part of a semiconductor wafer W to seal the peripheral edge part water-tightly, and an expansion part expanding inward is provided in prescribed positions along a circumferential direction of the seal part, for example, at a position corresponding to a notch part 4 provided in the semiconductor wafer W and at a position corresponding to a contact part with a contact 92 for power supply of the semiconductor wafer W. COPYRIGHT: (C)2010,JPO&INPIT |
