| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet peeling apparatus and a sheet peeling method capable of securely peeling an adhesive sheet by effectively preventing a peeling tape from being peeled from the adhesive sheet in the initial stage of the adhesive sheet peeling, as well as, preventing an object to which the adhesive sheet has been attached from being lifted, when the adhesive sheet is peeled. SOLUTION: A configuration includes a pasting means 12 for adhering a peeling tape T to an adhesive sheet S, pasted to a semiconductor wafer W and a holding means 13 for holding the peeling tape T, and in which the adhesive sheet S can be peeled by relatively moving the holding means 13, with respect to a table 15 that supports the semiconductor wafer W. The holding means 13 integrally comprises a pressing means 39, and the pressing means 39 is configured by a plate-like member 47, comprising a lift-up permission component 50, that causes a lift-up component SA formed in the initial stage of peeling of the adhesive sheet S to escape, as well as, imparting a constant pressing force to the adhesive sheet S. COPYRIGHT: (C)2009,JPO&INPIT |
