| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having a low modulus of elasticity and exhibiting good adhesiveness and bleed properties and to provide a semiconductor device having excellent reliability such as reflow resistance by using the resin composition as a die attach paste for a semiconductor or an adhesive material for a heat release member. SOLUTION: The resin composition is used for adhesion of a semiconductor element or the heat release member to a support. The resin composition is characterized as comprising a compound (A) represented by general formula (1) (wherein, R<SP>1</SP>is a hydrogen or a methyl group), a radical polymerization initiator (B) and a filler (C). The semiconductor device is manufactured by using the resin composition. COPYRIGHT: (C)2007,JPO&INPIT |
