SEMICONDUCTOR DEVICE INCLUDING INNER-INTERCONNECTION STRUCTURE

摘要

PURPOSE: A semiconductor device which includes an inside connecting structure is provided to omit the introduction of a separate printed circuit board for wiring routing by interlinking a pad of the semiconductor chip front side and a solder ball of the semiconductor chip back side. CONSTITUTION: A first connection terminal(210) is formed in the front side(101) of a semiconductor chip(100). A second connect terminal(450) is formed in the back side(103) of the semiconductor chip. A first arrangement of a first burying conductive line(310) and a second arrangement of a second burying conductive line(330) are introduced to be separated to a vertical direction. First conducting via(220) is connected to the first burying conductive line by passing through the front side of the semiconductor chip. Second conducting via(230) is connected to the second burying conductive line.