摘要 |
<p>A retaining ring for a chemical polisher comprises a generally annular body having a top surface (115), an inner diameter surface (235), an outer diameter surface (230) and a bottom surface (155), wherein the bottom surface has a convex shape and wherein a difference in height across the bottom surface is between 0.001 mm and 0.05 mm.
A method of using a retaining ring comprises lapping a bottom surface of an annular retaining ring to provide a target characteristic, the lapping being performed using a first machine dedicated for use in lapping the bottom surface of retaining rings; securing the retaining ring on a carrier head; and polishing a plurality of device substrates with a second machine using the carrier head, wherein the target surface characteristic substantially matches an equilibrium surface characteristic that would result from breaking-in the retaining ring on the second machine.
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申请人 |
APPLIED MATERIALS, INC. |
发明人 |
CHEN, HUNG CHIH;ZUNIGA, STEVEN M.;GARRETSON, CHARLES C.;MCALLISTER, DOUGLAS R.;MEYER, STACY;LIN, JIAN;HUEY, SIDNEY P.;OH, JEONGHOON;DOAN, TRUNG T.;SCHMIDT, JEFFREY;WOHLERT, MARTIN S.;HUGHES, KERRY F.;WANG, JAMES C.;LU, DANIEL CAM TOAN;DELAMENIE, ROMAIN BEAU;BALAGANI, VENKATA R.;ALLEN, ADEN MARTIN;FONG, MICHAEL JON |