| 摘要 |
PURPOSE: A wafer support plate and a utilization method thereof are provided to support a wafer using the wafer support plate, thereby half-cutting the wafer without using a dicing tape. CONSTITUTION: A wafer support part(32) is formed into a circular concave part and receives and supports a wafer. A plurality of penetration holes(34) is formed on the floor of the circular concave part. A frame part(33) surrounds the wafer support part. A transfer unit of a process device is applied to a frame part. A sliding prevention sheet is arranged on the floor of the circular concave part. |
