PURPOSE: A semiconductor package and a manufacturing method thereof are provided to improve solder bonding reliability by increasing contact area between a solder ball and a metal wiring. CONSTITUTION: A semiconductor chip includes a bonding pad(13). A metal wiring is electrically connected to the semiconductor chip. The metal wiring includes a terminal for connecting an external terminal. An insulating film(17) has an opening part for defining the terminal by covering the metal wiring. A molding film(110) molds the semiconductor chip. The molding film comprises a recess pattern which is extended toward the terminal from the bonding pad while exposing the bonding pad. The metal wiring is connected to the bonding pad by being embedded within the recess pattern.
