发明名称 |
White heat-curable silicone resin composition and optoelectronic part case |
摘要 |
A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a thermal conductivity of 1-10 W/mK. The composition is useful for forming cases on optoelectronic parts, typically LED.
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申请公布号 |
US8173053(B2) |
申请公布日期 |
2012.05.08 |
申请号 |
US20090480129 |
申请日期 |
2009.06.08 |
申请人 |
TAGUCHI YUSUKE;SAWADA JUNICHI;SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
TAGUCHI YUSUKE;SAWADA JUNICHI |
分类号 |
B29D11/00;C08L83/04;C08L83/06 |
主分类号 |
B29D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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