| 发明名称 |
Dummy pattern in wafer backside routing |
| 摘要 |
A device includes a semiconductor substrate including a front side and a backside. A through-substrate via (TSV) penetrates the semiconductor substrate. A dummy metal line is formed on the backside of the semiconductor substrate, and may be connected to the dummy TSV. |
| 申请公布号 |
US8174124(B2) |
申请公布日期 |
2012.05.08 |
| 申请号 |
US20100756727 |
申请日期 |
2010.04.08 |
| 申请人 |
CHIU MING-YEN;CHEN HSIEN-WEI;CHEN MING-FA;JENG SHIN-PUU;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHIU MING-YEN;CHEN HSIEN-WEI;CHEN MING-FA;JENG SHIN-PUU |
| 分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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