PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD

摘要

PURPOSE: A printed circuit board and a method for manufacturing the printed circuit board are provided to obtain fine patterns by reducing the generation of failure due to short circuits. CONSTITUTION: A supporting layer for forming metal foil is prepared(S110). A first plating resist for patterns is formed on one side of the metal foil(S115). A first circuit layer is formed by plating one side of the metal foil(S120). The first plating resist is eliminated(S130). The supporting layer is stacked to one side of an insulating layer in order to embed the first circuit layer(S140). The supporting layer is eliminated(S150). A hole is formed at the insulating layer through a laser processing process(S160). A second plating resist for patterns is formed on another side of the metal foil(S170). A second circuit layer is formed by plating another side of the metal foil(S180). The second plating resist is eliminated(S190). The metal foil is etched to electrically insulate the first circuit layer and the second circuit layer(S200).