发明名称 Multi-functional composite substrate structure
摘要 A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are interlaced above the third substrate. One or more permeance blocks may be formed above each substrate, so that one or more inductors may be fabricated thereon. One or more capacitors may be fabricated on the first substrate. Also, one or more signal transmission traces of the system impedance are formed on the second substrate of the outside layer. Therefore, the inductance of the inductor(s) is effectively enhanced. Moreover, the area of built-in components is reduced. Furthermore, it has shorter delay time, smaller dielectric loss, and better return loss for the transmission of high speed and high frequency signal.
申请公布号 US8174840(B2) 申请公布日期 2012.05.08
申请号 US20080260254 申请日期 2008.10.29
申请人 JOW UEI-MING;CHEN CHANG-SHENG;SHYU CHIN-SUN;LEE MIN-LIN;LAY SHINN-JUH;LAI YING-JIUNN;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 JOW UEI-MING;CHEN CHANG-SHENG;SHYU CHIN-SUN;LEE MIN-LIN;LAY SHINN-JUH;LAI YING-JIUNN
分类号 H05K1/16 主分类号 H05K1/16
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