发明名称 FILM FORMATION METHOD AND APPARATUS FOR SEMICONDUCTOR PROCESS
摘要 An insulating film is formed on a target substrate by CVD, in a process field to be selectively supplied with a first process gas containing a silane family gas, a second process gas containing a nitriding gas, and a third process gas containing a carbon hydride gas. This method includes repeatedly performing supply of the first process gas to the process field, supply of the second process gas to the process field, and supply of the third process gas to the process field. The supply of the third process gas includes an excitation period of supplying the third process gas to the process field while exciting the third process gas by an exciting mechanism.
申请公布号 KR101141870(B1) 申请公布日期 2012.05.08
申请号 KR20070004154 申请日期 2007.01.15
申请人 发明人
分类号 H01L21/205 主分类号 H01L21/205
代理机构 代理人
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