发明名称 |
Memory device interface methods, apparatus, and systems |
摘要 |
Apparatus and systems may include a substrate and a first memory device coupled to the substrate using a through wafer interconnect (TWI). An example may include an interface chip having a via to accommodate connection of the memory device to the substrate. Other apparatus, systems, and methods are disclosed.
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申请公布号 |
US8174859(B2) |
申请公布日期 |
2012.05.08 |
申请号 |
US20090619438 |
申请日期 |
2009.11.16 |
申请人 |
JEDDELOH JOE M.;MICRON TECHNOLOGY, INC. |
发明人 |
JEDDELOH JOE M. |
分类号 |
G11C5/06 |
主分类号 |
G11C5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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