METHOD OF COATING A SUBSTANCE ON A RF DEVICE AND SPUTTERING APPARATUS USED IN THE SAME

摘要

PURPOSE: A plating method for RF(Radio Frequency) equipment and a sputtering device used in the same are provided to improve the characteristics of RF equipment by maintaining a small thickness deviation of each portion. CONSTITUTION: A sputtering device comprises a supporting unit and first and second targets(600,602). An object(604) to be plated on RF equipment is placed on the supporting unit. The first target is formed of a material for plating the object. The second target is arranged separately from the first target. Power is respectively supplied to the first and second targets when the object is plated.