SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to reduce wire manufacturing or purchasing costs by electrically connecting a semiconductor chip and a lead using lead fingers without using a wire. CONSTITUTION: A lead frame(130) comprises a die paddle(120) and leads(110). A semiconductor chip(140) is mounted on the die paddle. Lead fingers(150) is extended from the lead frame. The lead fingers electrically connect the semiconductor chip and the leads. A molding part(170) molds the semiconductor chip and the lead fingers.