METHOD OF REMOVING OXIDE FILM AND SPUTTERING APPARATUS USED IN THE SAME, METHOD OF MANUFACTURING ELECTRONIC DEVICE USING METHOD OF REMOVING OXIDE FILM AND ELECTRONIC DEVICE FORMED BY APPLYING METHOD OF REMOVING OXIDE FILM

摘要

PURPOSE: An oxide film removing method, a sputtering apparatus which is used in the same, an electronic device manufacturing method, and an electronic device manufactured using the same are provided to improve electrical properties of an electronic device by performing a follow-up process in a sputtering apparatus after removing an oxide film. CONSTITUTION: A substrate(52) is mounted on a substrate holder(42) of a sputtering apparatus(30). The substrate comprises an element which forms an oxide film. The oxide film a natural oxide film. The oxide film is removed by supplying plasma generating voltage to the substrate holder. The substrate comprises a plurality of material layers which are successively laminated.