SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THEREOF

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to uniformly form the size of each semiconductor package using a mold strip in which separated mold parts are connected into one body for each individual semiconductor package region. CONSTITUTION: An electronic component(16) is mounted on the upper surface of a substrate. An insulating mold(14) has an internal space for storing the electronic component. The mold is fixed on the substrate. A conductive shield part(15) is electrically connected to a ground electrode(13). The ground electrode which covers the outer surface of the mold is exposed to the outside.