发明名称 COOLING-ARRANGEMENT
摘要 The invention relates to a cooling-arrangement. According to the invention the arrangement for cooling contains a device and a heat exchanger. The device is coupled with the heat exchanger in a way, that heat, which is generated asides the device, is transferred from the device to the heat exchanger. The heat exchanger is at least partly arranged into an ambient airflow. The heat exchanger is constructed in a way that the heat is transferred from the heat exchanger into the ambient airflow. The heat exchanger contains a suction side and a pressure side, which are arranged and constructed in a way that the ambient air, which passes by close to the sides, is accelerated for an improved heat transfer.
申请公布号 CA2756957(A1) 申请公布日期 2012.05.04
申请号 CA20112756957 申请日期 2011.11.02
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 LE BESNERAIS, JEAN
分类号 F28D1/00;F01P3/18;F03D11/00 主分类号 F28D1/00
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