| 摘要 |
<p>PURPOSE: A semiconductor package manufacturing method is provided to use a full cut process in a separation process into each semiconductor package, thereby uniformly arranging the size of the each semiconductor package. CONSTITUTION: An internal ground electrode(13) is arranged in the upper surface of a substrate(11). One or more electronic components(16) are mounted on the upper surface of the substrate. A insulating mold part(14) hermetically seals the electric component and internal ground electrode. A conductive shield part(15) is electrically connected to the internal ground electrode. An exposed region(B) of the internal ground electrode is exposed to the outside of the mold part.</p> |
