| 摘要 |
PURPOSE: A communication package module and manufacturing method thereof are provided to reduce the weight of a communication package module by integrating an antenna pattern unit with the communication package module. CONSTITUTION: One side of a main board(1) includes one or more signal electrodes. A communication package(2) is mounted on the main board. An antenna pattern unit is formed at the outside of the communication package. A junction unit(3) electrically connects the signal electrode with the antenna pattern unit. The communication package includes a package circuit board, an insulating molding unit, a shielding unit, and an insulation unit. The antenna pattern unit is formed at the outside of the insulation unit.
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