APPARATUS AND METHOD FOR BONDING SEMICONDUCTOR CHIP

摘要

PURPOSE: A semiconductor chip bonding device and method are provided to prevent contamination of a bonding tool due to an adhesive member when bonding a semiconductor chip by arranging a pollution prevention means between the bonding tool and the semiconductor chip. CONSTITUTION: A stage(110) supports a substrate member in which an adhesive member is spread. A bonding tool(150) bonds a semiconductor chip which is picked up by using a heat-pressing method to a chip bonding domain. A pollution prevention means(160) prevents contamination of the bonding tool by the adhesive member. The pollution prevention means is arranged between the bonding tool and semiconductor chip. The pollution prevention means comprises a film(210) in which an opening overlapped in an adsorption hole(152) is included.