MICROCHIP

摘要

Provided is a microchip which has both improved thermal responsiveness in a reaction chamber and ensured bonding strength between a cover member and a substrate. The microchip comprises a substrate which has a flow path groove formed on one surface thereof and a concaved reaction chamber part that is communicated through the flow path groove and a cover member which is thermally bonded to the one surface of the substrate, wherein a thin part having a lower thickness than that of the other part is formed over a region that contains only a part of the concaved reaction chamber part is formed in the substrate.