| 发明名称 |
SEALED AIR GAP FOR SEMICONDUCTOR CHIP |
| 摘要 |
A semiconductor chip including a substrate; a dielectric layer over the substrate; a gate within the dielectric layer, the gate including a sidewall; a contact contacting a portion of the gate and a portion of the sidewall; and a sealed air gap between the sidewall, the dielectric layer and the contact.
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| 申请公布号 |
US2012104512(A1) |
申请公布日期 |
2012.05.03 |
| 申请号 |
US20100914132 |
申请日期 |
2010.10.28 |
| 申请人 |
HORAK DAVID V.;HUANG ELBERT E.;KOBURGER, III CHARLES W.;LA TULIPE, JR. DOUGLAS C.;PONOTH SHOM;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HORAK DAVID V.;HUANG ELBERT E.;KOBURGER, III CHARLES W.;LA TULIPE, JR. DOUGLAS C.;PONOTH SHOM |
| 分类号 |
H01L27/088;H01L21/28;H01L21/336 |
主分类号 |
H01L27/088 |
| 代理机构 |
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