发明名称 OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION
摘要 Disclosed are overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, which surface has at least a portion made of a surface resin composition, and comprising a fibrous material, ii) a second component comprising an overmolding resin composition, adhered to said first component over at least a portion of the surface of said first component. The surface resin composition is selected from polyamide compositions comprising a blend of (A) one or more fully aliphatic polyamides selected from group (I) polyamides having a melting point of less than 230° C., and (B) one or more polyamides selected from group (II) polyamides having a melting point of at least 250° C., and wherein the matrix resin composition is selected from (B) or blends of (A) and (B).
申请公布号 US2012108122(A1) 申请公布日期 2012.05.03
申请号 US201113282516 申请日期 2011.10.27
申请人 ELIA ANDRI E.;KIRCHNER OLAF NORBERT;WAKEMAN MARTYN DOUGLAS;YUAN SHENGMEI;E. I. DU PONT DE NEMOURS AND COMPANY 发明人 ELIA ANDRI E.;KIRCHNER OLAF NORBERT;WAKEMAN MARTYN DOUGLAS;YUAN SHENGMEI
分类号 B32B5/02;B29C45/14 主分类号 B32B5/02
代理机构 代理人
主权项
地址