METHOD FOR CONNECTING ELECTRONIC PART AND CONNECTING STRUCTURE

摘要

Provided are a method for connecting electronic parts and a connecting structure that make the obtainment of high connection reliability possible. An anisotropic conductive film (20) is provisionally installed prior to thermal compression bonding so that: the border (16) between a circuit protection area (14) and a terminal area (15) of a second electronic part (12) is positioned on a single layer area (23) of the anisotropic conductive film (20); and the terminal area (15) of the second electronic part (12) is positioned on a double layer area (24) of the anisotropic conductive film (20).