| 摘要 |
An instrument pickup including a stack of thin laminated printed circuit boards. Each layer includes an etched coil conductor structure with narrow lines and spaces defining the coil structure. The layers are connected via through holes. The etched lines are smaller than the insulated copper wire (also sometimes called magnetic wire) of a conventional instrument pickup, which means that the size, volume and/or height of the pickup may be reduced relative to a conventional wire wound instrument pickup.
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