发明名称 |
PACKAGE INDUCTANCE COMPENSATING TUNABLE CAPACITOR CIRCUIT |
摘要 |
An integrated circuit (IC) for compensating for a package inductance is disclosed. A first ground pad is directly connected to an on-chip ground node. A second IC ground pad is connected to the on-chip ground node via a tunable capacitor circuit, where the capacitance of the tunable capacitor circuit resonates with the package inductance at the operating frequency of the IC. |
申请公布号 |
US2012105167(A1) |
申请公布日期 |
2012.05.03 |
申请号 |
US20100916338 |
申请日期 |
2010.10.29 |
申请人 |
MIN BYUNGWOOK;WU DER-WOEI;QUALCOMM INCORPORATED |
发明人 |
MIN BYUNGWOOK;WU DER-WOEI |
分类号 |
H03H7/00 |
主分类号 |
H03H7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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