发明名称 ELECTRONIC COMPONENTS ASSEMBLY
摘要 <p>[Problem] To reduce the mismatching of impedance at a connected part when electronic components are electrically connected to each other. [Solution] An electronic components assembly, wherein electronic components (1, 2) are electrically connected to each other, and wherein a wiring line (11) formed the surface (1a) of the first electronic component (1) and a wiring line (12) formed on the surface (2a) of the second electronic component (2) face each other and are bonded to each other through an electrically conductive material (13), thereby electrically connecting the first electronic component (1) to the second electronic component (2). The electrically conductive material (13) is a resin composition containing a solder or an electrically conductive filler.</p>
申请公布号 WO2012056661(A1) 申请公布日期 2012.05.03
申请号 WO2011JP05895 申请日期 2011.10.20
申请人 PANASONIC CORPORATION;TAKASHITA, HIROMITSU;TAKEDA, TSUYOSHI;KONNO, YUKO;FUJIWARA, HIROAKI;YOSHIOKA, SHINGO 发明人 TAKASHITA, HIROMITSU;TAKEDA, TSUYOSHI;KONNO, YUKO;FUJIWARA, HIROAKI;YOSHIOKA, SHINGO
分类号 H01L25/065;H01L21/60;H01L25/07;H01L25/18 主分类号 H01L25/065
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