发明名称 MULTILAYER CHIP CAPACITOR, MULTILAYER CHIP CAPACITOR ASSEMBLY AND FABRICATION METHOD OF MULTILAYER CHIP CAPACITOR ASSEMBLY
摘要 <p>A multilayer chip capacitor includes: a capacitor main body; a plurality of first and second inner electrodes; and m (m&gE;3) number of first and second outer electrodes. The plurality of first and second inner electrodes are connected with two outer electrodes positioned on both opposing surfaces and having the same polarity as that of the first and second inner electrodes, and classified into a plurality of groups depending on the locations of the outer electrodes connected to the first and second inner electrodes. At least one of two outer electrodes connected with inner electrodes of each group is different from an outer electrode connected with inner electrodes of a different group having the same polarity, and inner electrodes of one group are connected to outer electrodes connected with at least another one group so that all the inner electrodes belonging to the same polarity can be electrically connected.</p>
申请公布号 KR101141328(B1) 申请公布日期 2012.05.03
申请号 KR20090022578 申请日期 2009.03.17
申请人 发明人
分类号 H01G4/33;H01G4/30 主分类号 H01G4/33
代理机构 代理人
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