| 摘要 |
PURPOSE: A thermoelectric device and a manufacturing method thereof are provided to arrange a first semiconductor unit and a second semiconductor unit in parallel by sawing a bunch of a first semiconductor load and a second semiconductor load, thereby performing an alignment process while being combined with a first printed circuit board. CONSTITUTION: A first printed circuit board(110) and a second printed circuit board(120) are facing to each other. A first semiconductor unit(210) is arranged between the first printed circuit board and the second printed circuit board. The first semiconductor unit comprises a first insulator(211) and a first semiconductor material(213) which is located inside of the first insulator. A second semiconductor unit(220) is arranged between the first printed circuit board and the second printed circuit board. The second semiconductor unit comprises a second insulator(221) and a second semiconductor material(223) which is located inside of the second insulator.
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