METHOD FOR BONDING WIRE BETWEEN CHIPS OR BETWEEN CHIP AND METAL FRAME

摘要

A method for bonding a wire between chips or between a chip and a metal frame is provided. A first Au ball is wire-bonded to a second welding point by using a bonding machine. The method includes the following steps: welding a wire to a second chip or a frame that need to be connected; and then welding a second Au ball on the welding point of the wire that has been welded firmly on the second chip or the frame, so as to form a stable interconnection structure under the ball. The method can be applied to a variety of high-power LED lamps assembled by connecting LED chips for ensuring a stable and firm welding point, preventing false welding and sealing off, and improving the reliability of electric components.