DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF

摘要

PURPOSE: A device package, a manufacturing method thereof, and a test method are provided to measure leakage speed from the package using a standard leakage detection apparatus, thereby preventing malfunction of optical elements. CONSTITUTION: A base wafer(110) or a base grid comprises a plurality of base dies. A photo-electronic device is mounted on each photo-electronic device mounting region. A lid wafer or a lid grid is attached on the base wafer or the base grid. The lid wafer or the lid grid comprises a plurality of lid dies. The lid die is mounted on a lid mounting region in order to form a volume surrounded between the lid die and the base die.