SHEET FOR FORMING SEMICONDUCTOR WAFER PROTECTING FILM

摘要

PURPOSE: A semiconductor wafer protective film formation sheet is provided to prevent contamination of a circuit surface on a wafer due to film pieces by supplying the sheet with an external diameter which is smaller than the external diameter of the semiconductor wafer. CONSTITUTION: A composite material for manufacturing a protective film is coated on the surface of a base film(1). A protective film formation layer(2) is formed by drying the composite material. The upper part of the protective film formation layer is covered with a stripping film(3). A half cut process is performed on the stripping film and the protective film formation layer. A new stripping film(3') covers the protective film formation layer.