发明名称 |
Semiconductor Device and Method of Forming Wafer Level Ground Plane and Power Ring |
摘要 |
A semiconductor die has active circuits formed on its active surface. Contact pads are formed on the active surface of the semiconductor die and coupled to the active circuits. A die extension region is formed around a periphery of the semiconductor die. Conductive THVs are formed in the die extension region. A wafer level conductive plane or ring is formed on a center area of the active surface. The conductive plane or ring is connected to a first contact pad to provide a first power supply potential to the active circuits, and is electrically connected to a first conductive THV. A conductive ring is formed partially around a perimeter of the conductive plane or ring and connected to a second contact pad for providing a second power supply potential to the active circuits. The conductive ring is electrically connected to a second THV. |
申请公布号 |
US2012104601(A1) |
申请公布日期 |
2012.05.03 |
申请号 |
US201213346415 |
申请日期 |
2012.01.09 |
申请人 |
BADAKERE GURUPRASAD G.;CAMACHO ZIGMUND R.;TAY LIONEL CHIEN HUI;STATS CHIPPAC, LTD. |
发明人 |
BADAKERE GURUPRASAD G.;CAMACHO ZIGMUND R.;TAY LIONEL CHIEN HUI |
分类号 |
H01L23/498;H01L21/56;H01L21/60 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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