| 摘要 |
A mold-tool system (100), comprising: (i) a hot runner manifold assembly (102), (ii) a plate assembly (104) defining an air-cavity circuit (106), the plate assembly (104) being configured to support and surround, at least in part, the hot runner manifold assembly (102), and the air-cavity circuit (106) surrounding, at least in part, the hot runner manifold assembly (102); and (iii) means for forcing, in use, a relatively cooler air stream to the air-cavity circuit (106), wherein that the air-cavity circuit (106) is configured to: (i) increase, in use, thermal losses of the hot runner manifold assembly (102), and (ii) reduce time to cool down the hot runner manifold assembly (102) relative to heat lost as a result of natural convection associated with the hot runner manifold assembly (102).
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