发明名称 PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
摘要 There are provided a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: preparing a substrate having active regions and non-active regions, the non-active regions being formed on edges thereof; printing resists on dummy portions corresponding to the non-active regions of the substrate by using an inkjet printing method; curing the resists; and performing plating on the active regions of the substrate. The resists are masked on the dummy portions corresponding to the non-active regions of the substrate to prevent plating from being performed on the dummy portions, thereby reducing manufacturing costs.
申请公布号 KR101141358(B1) 申请公布日期 2012.05.03
申请号 KR20100073639 申请日期 2010.07.29
申请人 发明人
分类号 H05K3/10;H05K3/02 主分类号 H05K3/10
代理机构 代理人
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