发明名称 METHODS AND APPARATUS FOR CUTTING PROFILES
摘要 An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile.
申请公布号 US2012103050(A1) 申请公布日期 2012.05.03
申请号 US200813133133 申请日期 2008.11.04
申请人 LEE SANG MOO;SEOUL LASER DIEBOARD SYSTEM CO., LTD. 发明人 LEE SANG MOO
分类号 B21D31/00;B23D17/00;B26D3/00 主分类号 B21D31/00
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