发明名称 |
Systems and methods for improved heat dissipation in semiconductor packages |
摘要 |
Today's high speed semiconductor chips offer high performance at the expense of increase heat generation. A heat spreader can be build into a mold compound covering a semiconductor die in a semiconductor package by forming holes in the mold compound and filling the holes with a thermally conductive material such as thermally conductive adhesive. This heat dissipation capability can further be enhanced by a layer of thermally conductive material on the surface of the mold compound and optionally by an external metal layer or heat sink.
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申请公布号 |
US2012104591(A1) |
申请公布日期 |
2012.05.03 |
申请号 |
US20100925828 |
申请日期 |
2010.10.29 |
申请人 |
WARREN ROBERT W.;ROSSI NIC;CONEXANT SYSTEMS, INC. |
发明人 |
WARREN ROBERT W.;ROSSI NIC |
分类号 |
H01L23/34;H01L21/50 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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