Packaging structure and method for automotive components

摘要

The invention provides a packaging structure applied to an automotive component having semiconductors (3, 4) and electronic parts mounted on a ceramic base (1), characterized in that the semiconductors and electronic parts are partly ore entirely sealed with a thixotropic silicone gel (10) which has a thixotropy index of about 1.5 - 3.6 and a penetration depth of about 6 - 10 mm and a rate of change in viscosity of less than 10 % of the initial value.