发明名称 |
Composite build-up material for embedding of circuitry |
摘要 |
Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads.
The composite build-up materials comprise a carrier layer (1), a reasin layer without reinforcement (2), and a resin layer with reinforcement (3). The circuitry (9) is embedded into the resin layer without reinforcement (2). |
申请公布号 |
EP2448380(A1) |
申请公布日期 |
2012.05.02 |
申请号 |
EP20100188945 |
申请日期 |
2010.10.26 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
BRUDERER, ALEX;GALSTER, NORBERT;KRESS, JUERGEN;PROBST, MICHEL |
分类号 |
H05K3/00;H05K3/10;H05K3/46 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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