发明名称 METHOD OF FABRICATING CAPACITOR AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE INCLUDING THE SAME
摘要 PURPOSE: A manufacturing method of a capacitor and a manufacturing method of a semiconductor device including the same are provided to improve capacitance of the capacitor by forming a bottom electrode wider than a preliminary bottom electrode through ion implantation using boron or arsenic. CONSTITUTION: A gate insulating layer(102) is formed on a substrate(100). A first interlayer insulating film(112) is formed on the gate insulating layer. A second interlayer insulating film(118) is formed on the first interlayer insulating film. A preliminary bottom electrode(130) having a first area is formed on the substrate. A bottom electrode(132) having a second area which is wider than the first area is formed by ion-implanting on the preliminary bottom electrode. A dielectric film and a top electrode are formed on the bottom electrode. A bit line is electrically connected with a first impurity area. A capacitor is electrically connected with a second impurity area.
申请公布号 KR20120041522(A) 申请公布日期 2012.05.02
申请号 KR20100103016 申请日期 2010.10.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LIM, HAN JIN;SEO, JONG BOM;NAM, SEOK WOO;KIM, BONG HYUN;LEE, YONG JAE;IM, KI VIN
分类号 H01L27/108;H01L21/8242 主分类号 H01L27/108
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