发明名称 Heat pump type water heating apparatus
摘要 A heat pump type water heating apparatus is disclosed. The water heating apparatus includes a refrigeration cycle circuit (2) including a compressor (12), a dual heat exchanger (14), an expansion device (16), and an outdoor heat exchanger (18), via which a first refrigerant is circulated, the dual heat exchanger (14) including a first refrigerant and water heat exchanger (40) and a first refrigerant and second refrigerant heat exchanger (50), a cascade compressor (82) to compress the second refrigerant having passed through the first refrigerant and second refrigerant heat exchanger (50), a second refrigerant and water heat exchanger (84) to perform heat exchange between the second refrigerant compressed by the cascade compressor (82) and water, a cascade expansion device (86) to expand the second refrigerant having passed through the second refrigerant and water heat exchanger (84), and a water heating channel (8) connected to the first refrigerant and water heat exchanger (40) and the second refrigerant and water heat exchanger (84).
申请公布号 EP2447622(A2) 申请公布日期 2012.05.02
申请号 EP20110164616 申请日期 2011.05.03
申请人 LG ELECTRONICS, INC. 发明人 LEE, DONGHYUK;HA, JONGCHUL
分类号 F24H4/02;F24D17/02;F24D19/10;F25B7/00;F25B13/00;F25B25/00 主分类号 F24H4/02
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