Halbleiterbauelement mit einer Weichlotverbindung zwischen Teilen von wesentlich unterschiedlichen thermischen Ausdehnungskoeffizienten

摘要

1,079,022. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. Oct. 23, 1964, No. 43311/64. Heading H1K. In a semi-conductor device a semi-conductor body containing one or more PN junctions is soft-soldered to a component part of the device. Pressure is applied in the completed device to ensure that the parts will not separate in the event of the solder softening during (faulty) operation. The PN junction may be present in the semi-conductor body originally or it may result from the presence of impurity materials in the solder. In the rectifier shown a silicon or germanium disc 1 is soft-soldered between tungsten or molybdenum discs 2. The lower metal disc is soft-soldered to the copper base part 3 of the housing (which acts as a heat sink in operation) and the upper disc is soft-soldered to a copper disc 4 to which a stranded copper lead 7 is attached. Insulating bodies 12 isolate the pressurizing spring 9 from the electrode/semi-conductor assembly. Details are given of the lead-through tube 11 and of its possible modifications.