发明名称 |
Electronic component and electronic device |
摘要 |
An electronic component to be mounted on a substrate comprises an electronic component-side land that faces a substrate-side land provided on the substrate when the electronic component is mounted on the substrate. A non-soldered region is provided on a surface of the electronic component-side land, facing the substrate-side land, so that a shape of the substrate-side land is different from a shape of the electronic component-side land facing the substrate-side land. |
申请公布号 |
EP2447994(A2) |
申请公布日期 |
2012.05.02 |
申请号 |
EP20110180886 |
申请日期 |
2011.09.12 |
申请人 |
AISIN AW CO., LTD. |
发明人 |
NAKAGAWA, HITOSHI;TOKUYAMA, GEN;MIZUNO, YUKI |
分类号 |
H01L23/498;H01L23/485 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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