| 摘要 |
PURPOSE: Chemical supplying apparatus and method for supplying chemicals without bubbles are provided to eliminate bubbles from a chemical which is supplied to a semiconductor device such as a substrate coating device. CONSTITUTION: A chemical supplying method includes the following: a chemical transferring process transfers chemical to a buffer(120) through a chemical transferring pipe(77); a chemical supplying process supplies the chemical through a chemical supplying pipe(88) formed at the bottom of the buffer; a pressure measuring process measures the pressure of the chemical transferring pipe using a pressure sensor(130); if pressure fluctuations are generated in the pressure sensor, the supplying of the chemical is stopped; and bubbles are discharged from the buffer through a bubble discharging path formed at the upper part of the buffer.
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